HS Code: 81019910
u/Mo/Cu(CMC)Product Brief Introduction
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
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The features of copper molybdenum copper
Large sized sheets available ( length up to XXmm, width up to XXmm)
Can be stamped into components
Strong interface bonding resist to 850ºC heat shock repeatedly
Tailorable CTE matching that of semiconductor and ceramics
High thermal conductivity
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Product Properties
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| Material | g/ Density at 20ºC |
(10-6/k) Coefficient of thermal expansion at 20ºC |
W/M.K Thermal conductivity at 25ºC |
|
| In-plane | Thru-thickness | |||
| 13:74:13 | 9.88 | 5.6 | 200 | 170 |
| 1:4:1 | 9.75 | 6.0 | 220 | 180 |
| 1:3:1 | 9.66 | 6.8 | 244 | 190 |
| 1:2:1 | 9.54 | 7.8 | 260 | 210 |
| 1:1:1 | 9.32 | 8.8 | 305 | 250 |
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